Below we have a number of publications, papers and presentations that you may find of interest. Please click on the titles below to download the documents. 

The effect of in-stu Formic acid treatment on oxide reduction Cu wafer bonding

A new tool for aligned embossing and imprinting

Variable bond strength in low T directly bonded wafers

AML Adhesive bonding - High Accuracy 

Alignment accuracy abstract

Low temperature bonding using in-situ radical activation.

A new tool for aligned micro-embossing and nano-imprinting, pp 61-64,

AML AW04 improves performance of MEMS Gyro!

Latest SEA results on AML IN-SITU Aligner-Bonder

Reduction of misalignment in bonding of MEMS wafers through the use of in-situ optics

Factors affecting wafer alignment during anodic bonding

The effect of elapsed time since cleaning" on the properties of anodically bonded wafers

Improvements in MEMS gyroscope production

Selection of glass, anodic bonding conditions and material compatibility for silicon/glass capacitive sensors

Considerations of Anodic Bonding for Capacitive Type Silicon/Glass Sensor Fabrication

T. Rogers and J. Kowal. Anodic Bonding; A wafer scale packaging technique for MEMS devices. Proceedings of the International MEMS workshop 2001 Pages 570-576, 4-6 July, 2001, Singapore