Unique in-situ aligned wafer bonding machines & services
for IC, MEMS, Compound, Semiconductor & PV Industries

FAB12 Cassette Bonder

FAB12 Cassette Bonders bring the unique benefits of AML aligner bonders to high throughput processing for pilot lines and volume manufacture:

  • machines.jpgIn-situ alignment – simulaneous heating, pumping and alignment gives high throughput in a single bond chamber –no cluster tool required.
  • Brooks Automation.
  • Wafer Size: 150mm & 200mm (300mm ready).
  • Alignment Accuracy 1 micron
  • Low Cost of Ownership & Small Footprint.
  • SECS/GEM, SECS300 & E84 Compliant.
  • Anodic, Eutectic, Direct, Thermocompression, Adhesive and Glass Frit Bonds.
  • Options: UV Adhesive Curing, Through-Wall mounting and Class 1 Mini-Environment (Laminar Flow System between cassettes & process chamber).
  • Wafer Size 150 & 200mm (300mm ready).
  • Wafer Thickness Max Stack Height 6.5mm.
  • Wafer Handling 3mm Perimeter Exclusion Zone Contact.
  • Max Temperature 560° C.
  • Base Pressure 10-6mbar range.
  • Pumping Time 5 min (to 10-5mbar).
  • Max Bond Force 25kN.
  • Number of Cassettes 2 or 3 (FOUP, SMIF or Open Cassette Load Ports).
  • Process Gas Ports 4.
  • Transparent and opaque wafers.
  • Alignment marks on front or back side.
  • Options - Class 2 (ISO14644-1) mini environment(Laminar flow unit), UV Curing (Adhesive Bonding) and Through Wall.

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