Unique in-situ aligned wafer bonding machines & services
for IC, MEMS, Compound, Semiconductor & PV Industries

Applied Microengineering Ltd (AML) is an independent private company established in 1992...

We manufacture unique in-situ aligned wafer bonding machines and provides services based around waferbonding in its state-of-the-art multi-million pound BONDCENTRE facility situated on UK’s premiere science park in Harwell, Oxfordshire.

You can find out about AML by viewing our video: 


robnickoffice.jpgOur unique Aligned Wafer Bonder machines, the only machines capable of in-situ alignment, activation and bonding on the market, are particularly suited to the bonding requirements of MEMS, IC, & III-V industries. The machines have the flexibility for R&D and the throughput and automation for volume production as well as the lowest cost of ownership and first class support.

The machines and services are sold worldwide via agents & distributors: China, Hong Kong, USA, India, Israel, Europe, Canada, Japan, Korea, Taiwan, Singapore and Australia.

We also have a comprehensive BONDCENTRE which provides services from the development of bonding processes to a commercial bonding service – one off to low volume. Associated services include; powder blasting, screen printing & metrology, a ‘One Stop’ wafer bonding service. The BONDCENTRE offers the perfect venue for those involved in bonded substrates, device fabrication, 3D integration and wafer level packaging.

First in Micro-Nano Technology

AML was the first company formed specifically to exploit MEMS technology or Micro-Nano Technology (MNT) as it is now known. After a number of years designing and producing MEMS devices such as Micro sensors and Microfuidic devices, AML changed direction and now focuses solely on wafer bonding equipment & services.


We have a number of publications, papers and presentations on the subject of Aligned Wafer Bonding and associated technology that you may find of interest. Read more here...

Find out more about our products & services ring us on +44 (0)1235 833934


Next Course: Wafer Bonding
Date: TBD

Location: TBD

The objectives of the course are to make the attendees aware of the properties and the potential of various wafer bonding processes, their applicability to the fabrication of MEMS devices and use as batch compatible first order packaging processes.

Full details can be found on the FRSM website.

Please contact us for more details.


If you are interested in joining us at AML you can view our latest career opportunities by visiting our Careers page.

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