Wafer Bonding  

Current Vacancies

  • Design Dev or ‘Systems’ Engineer
  • MEMS-IC Process Engineers- with clean room experience
  • Applications Engineers with experience of wafer processing especially MEMS & Wafer Bonding
  • Engineers with experience in building and servicing Semiconductor equipment

Design Dev or ‘Systems’ Engineer

General Engineering Mechanical / Electrical skills – and 3D CAD i.e. Solid works

Senior & junior positions available:

Talented and ambitious Engineers to work on existing & new machines that are used in the manufacture of semiconductors.
 

Main Duties & Responsibilities:

Designing, Developing and testing improvements, new functions and new variants of AML’s aligned wafer bonding machines.

 

Person specification: (Skills, Experience, Qualifications necessary to do the job

Good General degree in Engineering OR Physics OR other suitable hard science with a strong Mechanical – Electrical Engineering background

-          3D CAD software, preferably Solidworks

Experience of developing low volume, high value, precision electro-mechanical semiconductor or vacuum equipment & instrumentationin an R&D environment


Applications engineers required

You should have experience of wafer processing (Wafer bonding ideally) and are outgoing, enjoy meeting customers and worldwide travel!

General  technical opportunities at AML

We are always looking for good people with relevant experience in a broad range of activities ranging from R&D & design through to manufacturing, support and installation of semiconductor type equipment.


Sales & Marketing opportunities at AML

Vacancies exist for experienced Sales and Marketing professionals and also those of you with a technical background in a physical science but want to enter the commercial world in Sales and Marketing.

Salary negotiable.  

If you have an interest in any of these position please send your CV to  e-mail: aml@aml.co.uk with current salary