Wafer Bonding  

UNIQUE RADICAL BONDING CAPABILITY KILLS COMPETITION!

In two recent contract wins, AML (Applied Microengineering Ltd) has advanced its position as a key supplier to the international micro- and nano-technology community.

First AML won a highly competitive, European tender to supply their unique Aligner Wafer Bonder system to The Fraunhofer Institute for Mechanics of Materials (IWMH Halle, Germany). IWMH has a worldwide reputation for its expertise in wafer bonding and so the decision to buy an AML AWB-04 wafer bonder is hugely prestigious. Dr Jörg Bagdahn of the Fraunhofer Institute said, “AML provided the best combination of performance, flexibility and price for our research and development activities. We look forward to developing a mutually beneficial relationship.”

In another win, Semefab (Scotland) have placed an order for the AWB-08 system for their expanded MEMS fab 2 foundry. It will be used for both volume manufacture and SemeMEMS development projects, using a wide range of bonding processes on 4” and 6” wafers, with a simple route to migrate to 8” wafers when required. Ian McNaught of Semefab Scotland says, “The combination of performance, process flexibility and price, as well as the excellent technical and process support offered by the AML BONDCENTRE were deciding factors in choosing AML. I am confident that AML shall be a strong collaborative partner and that this will further strengthen the UK nanotechnology network.”

 Both systems include the revolutionary, new RAD Technology (Radical Activation - short listed for an award this year) which enables high quality, low temperature direct bonding processes to be carried out within the bond chamber. Lower temperatures give greater design freedom and have been a prime requirement for many in the MEMS, IC, III-V and optical industries.

 AML’s unique system, designed and manufactured in-house, activates, aligns and bonds in a single chamber. This delivers several benefits: increased accuracy, reliability and speed, with obvious cost advantages. With incredible flexibility, it is also ideally suited to getter activation and vacuum encapsulation as well as Nano-emboss & imprint.

Rob Santilli (MD of AML), “These sales demonstrate that AML Wafer Bonders are at home in both a production environment as well as research. We put a significant proportion of our investment into R&D and this pays off in the machines we produce and the processes we can offer. Combine this with AML’s new BONDCENTRE services; from a routine commercial bonding service, to process development, technology transfer and training and over 20 years experience in MEMS, we have an unbeatable, world class capability.”

AML has seen a sharp increase in sales since expanding its unique BONDCENTRE facility in Harwell, UK. Recognised by the UK government as a centre of excellence, the BONDCENTRE has received funding from the Department of Trade and Industry for the last two years, enabling the company to make its expertise available internationally.  

The Wafer Bonding technique is increasingly in demand for new applications: current areas of interest include MEMS (microelectromechanical systems), microelectronics, life sciences, optics and compound semiconductors, device packaging and advanced engineering substrates.

Integrated Sensing Systems(ISSYS) Selects the AML Wafer Bonder  from OAI for Production

San Jose, CA: December 3, 2006 - ISSYS, a world leader in the manufacture of MEMS devices, has announced the purchase and installation of the AML Bonder from OAI. OAI is a leading manufacturer of precision UV Lithography Equipment for MEMS, Semiconductors, Microfluidics and other emerging markets. In response to increasing customer demand, ISSY is expanding its production capabilities by purchasing from OAI both its stand-alone wafer bonder and advanced mask aligner system. ISSYS' increased production will meet the expanding market for MEMS devices.

"Purchasing the AML bonder and the 800 MBA Mask aligner from OAI has given us the key tools for the expansion of our production capabilities. After careful evaluation of other bonders, we choose the AML wafer bonder for our production wafer needs. The AML bonder coupled with OAI's mask aligner meet our production criteria for flexible, reliable, technically precise systems that can accommodate the rapidly changing demands of device production. We at ISSYS are also very pleased with OAI's dedication to customer support and to our specific needs."said Dr. Nader Najafi, President /CEO of ISSYS.

"ISSYS is a leading MEMS foundry. After careful testing, they chose the AML wafer bonder and OAI's backside aligner over the our competitors, Suss and EVG. The main reasons for their choosing both the AML bonder and OAI's mask aligner are the combination of impressive specifications with cost-effective pricing. At OAI, we are pleased to be part of the production team with ISSYS," says Charles Turk, President of OAI, San Jose, CA, USA.

The AML bonder is a semi automatic, stand-alone, computer controlled, substrate bonder. It features a rigid vacuum pressure chamber, upper and lower independent heaters, superior post alignment accuracy, and a twin camera system with through-the-lens illumination. With a small foot print, fast throughput, budget friendly pricing and flexible platform, the AML bonder is unique in its versatility to be used with any manufacturer's mask aligner.

ISSYS is a leader in advanced micro-machining technologies for medical devices, and micro-fluidic and scientific analytical sensing applications used in the development of drug infusion pumps and wireless, implantable sensing systems. Founded in 1995 by world-renowned leaders in MEMS technology, ISSYS is one of the largest independent MEMS companies in the United States. An ISO 9000:2000 certified organization; ISSYS operates a multi-million dollar state of the art Bio-MEMS fabrication facility located near Ann Arbor, Michigan.

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