Unique in-situ aligned wafer bonding machines & services
for IC, MEMS, Compound, Semiconductor & PV Industries
 

Wafer bonding has found many applications in the field of MST, MEMS, III-Vs & ICs and AML machines can be used in the following applications:

  • High accuracy aligned adhesive bonding “best tool”.
  • MEMS devices - pressure sensors, accelerometers.
  • Vacuum encapsulation – ‘best tool on the market’.
  • 1st Level Packaging of devices e.g. silicon microstructures to isolate package induced stresses.
  • Wafer Scale Packaging – MEMS & IC.
  • III-V bonding e.g. new high performance LEDs.
  • 3D Interconnects & TSV.
  • Temporary bonds for handle wafers.
  • Advanced bonded substrates e.g. silicon-on-glass (SOG).
  • Smart cut - Layer transfer.
  • Microfluidics.

 

For more on our Bondcentre services ring us on +44 (0)1235 833934

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