AML's BONDCENTRE provides a wealth of experience. Services it offers are: Wafer Bonding Process Development e.g. for many novel materials; silicon, glass, sapphire, strained silicon, InP, GaAs, Wafer Bonding process selection & design for your application Commercial Wafer Bonding Service prototype to production Wafer Bonding Technology Transfer (inc Equipment) & Training Associated Processes (Pre & Post Bond) AML provides a commercial, fast turn round, Wafer Bonding Service for 2", 3", 4", 6" & 8" wafers Wafers cleaned and bonded in a class 10 clean room environment Available In-situ Aligned Wafer Bonding Techniques: Adhesive Anodic Direct (High & Low Temperature Unique RADICAL activation) Eutectic Glass Fit Thermo-compression Applications knowledge for: MEMS LEDs Advanced Substrates 3D integration, TSV (Through-Silicon-Vias) Temporary Bonding Vacuum Encapsulation Wafer Level Packaging Smart Cut - Layer Transfer
		Wafer / Process Information for AML Bonding Service Click below to download and complete our information sheet to request a quote: 366kb Or download our BONDCENTRE information sheet:- 789kb
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