Unique in-situ aligned wafer bonding machines & services
for IC, MEMS, Compound, Semiconductor & PV Industries

See us at the following Events

    • Semicon China, Shanghai, March 15-17, 2016 


Recruitment: AML urgently need; Equipment Engineers, Mechanical Design Development Engineers, "Boffins", Engineering Technicians, Electrical Engineer, Wafer Process Engineers & Labview SW Developer
See our Careers page for details

AML develop new revolutionary Temporary bonding technique for TSV applications - inviting end users


AWB Flyer

Wafer Bonder enquiry form

Wafer Bonding service enquiry form

The complete package - off the shelf or custom machines bonding process know how and support from our Bondcentre...

AML manufactures unique in-situ aligned wafer bonding machines and provides services based around waferbonding in its state-of-the-art multi-million pound Bondcentre facility situated on UK’s premiere science park in Harwell, Oxfordshire.

AML’s unique Aligned Wafer Bonder machines are the only machines capable of in-situ alignment, activation and bonding on the market. Read more...

distributors worldwide

For more information on our products & services ring us on +44 (0)1235 833934

AML Machines


NEW "ROCK" Platform

NEW UHV Bonders

The design of our machines has benefited from over 20 years experience of Aligned - Wafer Bonding at AML. Our AWB04, AWB08, and FAB12 machines create an AWB platform with a number of unique technical and commercial benefits. Read more..

AML’s comprehensive Bondcentre provides services from the development of bonding processes to a commercial bonding service – one off to volume. Read more...

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