Unique in-situ aligned wafer bonding machines & services
for IC, MEMS, Compound, Semiconductor & PV Industries
 

See us at the following Events

  • Semicon Europa, Dresden, Germany 6-8 October 2015 
  • WaferBond Conference | December 7th – 9th , 2015 in Braunschweig, Germany

 

Recruitment: AML urgently need; Mechanical Design Development Engineers, "Boffins", Engineering Technicians, Electrical Engineer, Wafer Process Engineers
See our Careers page for details

AML develop new revolutionary Temporary bonding technique for TSV applications - inviting end users
Read more...

 


Wafer Bonder enquiry form

Wafer Bonding service enquiry form

The complete package - off the shelf or custom machines bonding process know how and support from our Bondcentre...

AML manufactures unique in-situ aligned wafer bonding machines and provides services based around waferbonding in its state-of-the-art multi-million pound Bondcentre facility situated on UK’s premiere science park in Harwell, Oxfordshire.

AML’s unique Aligned Wafer Bonder machines are the only machines capable of in-situ alignment, activation and bonding on the market. Read more...

distributors worldwide

For more information on our products & services ring us on +44 (0)1235 833934

AML Machines

FAB12Rendercrop.jpg

NEW "ROCK" Platform

NEW UHV Bonders

The design of our machines has benefited from over 20 years experience of Aligned - Wafer Bonding at AML. Our AWB04, AWB08, and FAB12 machines create an AWB platform with a number of unique technical and commercial benefits. Read more..

AML’s comprehensive Bondcentre provides services from the development of bonding processes to a commercial bonding service – one off to volume. Read more...

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