Unique in-situ aligned wafer bonding machines & services
for IC, MEMS, Compound, Semiconductor & PV Industries

See us at the following Events

  • Semicon Malaysia, Penang, 22-24 April 2015 


Recruitment: AML urgently need; Mechanical Design Development Engineers, "Boffins", Engineering Technicians, Electrical Engineer, Wafer Process Engineers
See our Careers page for details

AML develop new revolutionary Temporary bonding technique for TSV applications - inviting end users


Temporary Bonding Press release

AML Corporate Presentation
AML Unique Technical Benefits
BONDCENTRE Services Flyer
AWB Bonder Flyer
FAB12 Flyer
Bonder enquiry form
BONDCENTRE enquiry form

The complete package - off the shelf or custom machines bonding process know how and support from our Bondcentre...

AML manufactures unique in-situ aligned wafer bonding machines and provides services based around waferbonding in its state-of-the-art multi-million pound Bondcentre facility situated on UK’s premiere science park in Harwell, Oxfordshire.

AML’s unique Aligned Wafer Bonder machines are the only machines capable of in-situ alignment, activation and bonding on the market. Read more...

distributors worldwide

For more information on our products & services ring us on +44 (0)1235 833934

AML Machines


NEW "ROCK" Platform

NEW UHV Bonders

The design of our machines has benefited from over 20 years experience of Aligned - Wafer Bonding at AML. Our AWB04, AWB08, and FAB12 machines create an AWB platform with a number of unique technical and commercial benefits. Read more..

AML’s comprehensive Bondcentre provides services from the development of bonding processes to a commercial bonding service – one off to volume. Read more...

click to visit our Linked in pageprint this page