for IC, MEMS, Compound, Semiconductor & PV Industries
AML 20 years old this October! AML presentations at MEMS Conferences in China. Shanghai Nov 13 & Beijing Nov 15th. Recruitment: AML urgently need; Design Dev Mechanical / Electrical Engineers AML develop new revolutionary Temporary bonding technique for TSV applications - inviting end users Wafer Bonding Course: Our next course on Wafer Bonding is to be held on 27th November 2012 at Neuchatel, Switzerland.
Wafer Processing Engineers & Production Technicians
See our Careers page for details
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AML Corporate Presentation
AML Unique Technical Benefits
BONDCENTRE Services Flyer
AWB Bonder Flyer
FAB12 Flyer
Bonder enquiry form
BONDCENTRE enquiry form
The complete package - off the shelf or custom machines bonding process know how and support from our Bondcentre...
AML manufactures unique in-situ aligned wafer bonding machines and provides services based around waferbonding in its state-of-the-art multi-million pound Bondcentre facility situated on UK’s premiere science park in Harwell, Oxfordshire.
AML’s unique Aligned Wafer Bonder machines are the only machines capable of in-situ alignment, activation and bonding on the market. Read more...
For more information on our products & services ring us on +44 (0)1235 833934
The design of our machines has benefited from over 20 years experience of Aligned - Wafer Bonding at AML. Our AWB04, AWB08, 'Brute' and FAB12 machines create an AWB platform with a number of unique technical and commercial benefits. Read more...
AML’s comprehensive Bondcentre provides services from the development of bonding processes to a commercial bonding service – one off to volume. Read more...
